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CAV-600
CCD AUTOMATIC VACUUM PRINTER
Model:
CAV-600
Use to:
It is suitable for filling metal colloid in semiconductor chip production process, such as vacuum filling of copper glue and silver glue.
Characteristic:

1,CCD automatic alignment system. 

2,Automatic loading and unloading system. 

3,The net bottom automatic cleaning system. 

4,Scraper automatic parallel, constant pressure mechanism.

Project

Details

Function Parameters

Board Specifications

Types of processed products

Applicable to vacuum hole filling operations for resin, copper paste, and silver paste on rigid/flexible PCB boards, including through-hole, blind via, back-drilled hole plugging, and high aspect ratio resin hole plugging.‌‌

Assignment style

Capable of operating through stencil under both vacuum and atmospheric pressure conditions

Board Thickness

Max:3.0mm       Min:0.1mm

Board Size

Max:300*300mm      Min:50*150mm

Plug hole blind hole maximum depth ratio

8:1 No voids or dents

Squeegee Function

Hole speed

0~600 mm/sec adjustable

Plug hole printing pressure

1- 200KG adjustable

Plug hole scraper angle

±15°

Available squeegee thickness

10mm/20mm/35mm

Scraper stroke

0~318mm   adjustable

Plug hole scraping drive

Servo motor with timing belt drive

Plug hole scraping method

Single Doctor-Blade Ink Coating Printing

Plug hole scraping guide

Double Rail

Plug hole alignment accuracy

≤0.01mm

Mesh Base Specifications

Plug hole scraping direction

Front-facing control panel with reciprocating doctoring movement

Frame Size

Max:W650*D600mm

Min:W550*D500mm(Grid Framework Height>4MM)

Frame thickness

30~40 mm

Stencil fixation

Four-Point Pneumatic Clamping with Two-Point Mechanical Gripping

CCD Specifications

Net Block Rise

0~350 mm

Quantity

2

Resolution

4.7um/pix

Effective field of vision

15*10mm

CCD indexing hole size

Max:W160*D260mm      Min:W40*D100mm 

CCD Alignment Mode

Positioning

UVW Alignment Platform

Positioning accuracy

±0.005MM

Alignment time

≤1s

Alignment target requirements

1mm- 4mm

External Device Specifications

Power supply

AC380V、3PH、Neutral & Ground Wire Provisions、Power 18Kw、Power Consumption 7 kWh/h

Cooling water

5-15℃,flow≥10L/min,Water Pressure 3- 4KG Connection to 1" PVC Rigid Pipe with Quick Coupling

Compressed air

7- 8 kg/cm²、flow≥10L/min,Connection to 1/2" Rigid Pipe with Quick Coupling‌ ‌

Vacuum pump group hot exhaust

Pipe Diamete200mm,Exhaust Ventilation Volume6-10CMM

Temperature and humidity

22±2℃,50%±5,Cleanroom Class: Class 10,000

Appearance & Weight‌ ‌

Equipment dimensions

L3011*W2814*H2143 mm

Device body weight

5006KG

Loading and unloading mechanism weight

370KG

Vacuum pump set weight

590KG

Total weight of equipment

5966KG

Notice:‌ Due to product model variations and ongoing technical modifications, ‌device dimensions and configurations may deviate from this specification document‌. This document serves ‌pre-contract reference only‌; final specifications shall be governed by ‌signed contractual agreements

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