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Current:
PCB
VPV-900
VERTICAL VACUUM PRINTER
Model:
VPV-900
Use to:
Carrier board, TGV glass substrate, PCB high density hole, through hole, blind hole, back drilling, vacuum resin plug operation.
Characteristic:

1,IC carrier board and ≥ 300,000 high density hole products. 

2,AI server ultra-high aspect ratio ≥50:1 PCB products. 

3,A small number of diverse material number without special production of screen plate and fixture plate.

1、Substrate parameters

Workable board size

MAX:24.5''x32''  MIN:10''x10''

Workable board thickness

0.25mm-8mm ,weight<10KG
Minimum margin 12.6mm
Plug hole through hole diameter 0.1-2.0mm   No voids or dents
Maximum aspect ratio (sheet thickness: aperture) 80:1(Thickness 10mm, Aperture 0.1mm)
Plug hole aperture and aspect ratio 0.05mm ( 2:1) No voids or dents
2、Cycle Time
Normal production capacity 20- 40P/H(Depends on both the thickness-to-diameter ratio and the selected operating vacuum level
3、Function Parameter
Upper and lower board mode Manual Board Handling: Mounting & Demounting
Plug stroke 0-850mm
Plug running speed 1-100mm/s
Plug pressure

10-200kgf

Shaving head running speed

1-300mm/s

Shaving head pressure

10-160kgf

Working vacuum

Selectable range:30~20000Pa

Ultimate vacuum

≤30pa

4、Operation and peripheral

Control method

Button Control or Human-Machine Interface Operation

Mode of operation

Switchable Mode (1) Automatic: single-action cycle

                             (2)Manual Mode: Independent Actuation

Safety device

Safety Light Curtain Protection

Power supply

380V ,3PH,power 12kw

Air pressure

flow 10L/min ,8kg/cm²

5、Appearance weight

Body material

Q235A  Anticorrosion Treatment

Appearance sheet metal

SUS304

Dimensions

L2880*W2416*H2584mm

Net weight

1600KG

Due to product updates, the product specifications in this catalog are subject to the latest physical products.

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